CTF-Glorysoft (Shanghai) Co.,Ltd.
Product Center
Product Center
数字化设备平台
Digital Equipment Platform

The Digital Equipment Platform utilizes component-based, script-driven, and modular architecture to empower advanced equipment manufacturers in developing high-performance automated control systems, covering equipment software suites and simulation solutions.

Core solutions include: CTF, PDS, iEQ.

  • CTF (Cluster Tool Framework)
    CTF is Glorysoft's proprietary semiconductor equipment software platform, providing equipment manufacturers with efficient, flexible, and scalable software solutions.
    Platform Functions
    Software Features
    Platform Functions
    ·GUI - Graphical User Interface & Configuration Customization
    ·CTC - Cluster Tool Controller / Scheduling, supporting customization
    ·PM - Process Module
    ·FA - Factory Automation (GEM/GEM300)
    ·CM - Cassette Module Unit
    ·RCP - Recipe Management
    ·LPRC - Remote Procedure Call
    ·HIST - History Logging
    ·ALARM - Alarm Handling
    ·LOG - Log Management
    Software Characteristics
    Characteristic 1
    Supporting dual-platform deployment on Windows and Linux. The Windows platform supports rapid iteration and multi-functional development, while the Linux platform offers higher security, aligns with open-source software policies, and meets varied customer requirements.
    Characteristic 2
    Utilizing multi-node deployment to effectively distribute performance loads, seamlessly handling big data scenarios and supporting multi-control system coordination with excellent scalability.
    Characteristic 3
    Functional components are designed as independent modules supporting agile development with standard features that can be customized to customer specifications.
    Characteristic 4
    Capable of dynamically dispatching various drivers and unit modules to adapt to equipment models from different semiconductor manufacturers, integrating customer-proprietary features to deliver customized solutions.
    Product Advantages

    增强兼容性

    CTF's software communication bus architecture supports plug-and-play for equipment sensors, significantly reducing system complexity.

    工程与制造一体化

    应用生态

    Fully compatible with Linux and Windows cross-platform applications, broadening client reach.

    分析结果可解释、可追溯

    终端验证实效

    Successfully deployed and running stably in multiple 300mmes wafer fabs, accumulating numerous real-world cases that fully verify its reliability and practical utility.

    工程与制造一体化
  • iEQ(Intelligent Equipment Communication)
    iEQ is an independently developed core industrial communication solution specifically designed to provide high-efficiency, stable equipment communication and data exchange services for pan-semiconductor enterprises.
    Industry Pain Points
    Product Empowerment Value
    Industry Pain Points
    Pain Point 1
    Developing communications between PLCs and host systems is highly difficult, incurring high labor and time costs.
    Pain Point 2
    Using third-party hardware involves high costs and poor adaptation/compatibility, failing to meet market demands.
    Pain Point 3
    Lacking unified standards and domain experience in automation.
    Product Empowerment Value
    Value 1
    Supporting major PLC vendors covering mainstream communication protocols.
    Value 2
    Providing standard SECS/GEM interfaces for seamless integration with host systems.
    Value 3
    Uninterrupted stable operation with high data transmission reliability.
    Product Advantages

    Simple plug-and-play installation; configured via Web Client, offering powerful functions, flexible configuration, and real-time execution.

    工程与制造一体化

    Deeply integrated with equipment, offering standard SECS/GEM interfaces for direct seamless integration with host systems like EAP and MES, realizing information transmission, data collection, and process control.

    分析结果可解释、可追溯

    Fully compatible with SECS/GEM standard functional interfaces, running stably 24/7 with high data transmission performance.

    工程与制造一体化
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